VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Data Sheet
SONET/SDH 2.5Gb/s Laser Diode Driver
Figure 6: Pad Assignments for VSC7925 Die
VSC7925
1720
1620
50
50
50
120
120
150
PAD 34 PAD 33 PAD 32 PAD 31 PAD 30 PAD 29
DCC
VSS
VSS
VSS
VSS
VIP
PAD 1
DINTERM
PAD 2
DINTERM
PAD 3
DIN
PAD 4
GND
PAD 5
GND
PAD 6
CLOCK
PAD 7
CLOCKTERM
PAD 8
CLOCKTERM
VSS
PAD 9
VSS
PAD 10
GND
PAD 11
PAD 28 PAD 27 PAD 26
MIP
MIP
MIB
PAD 25
VIB
PAD 24
GND0
PAD 23
OUT
PAD 22
OUT
PAD 21
GND0
PAD 20
GND0
PAD 19
NOUT
PAD 18
IBIAS
30
1620
1720
GND
GND
GND
GND NMARK MARK
PAD 12 PAD 13 PAD 14 PAD 15 PAD 16 PAD 17
Dimensions in micrometers.
50
1)
2)
3)
4)
5)
Die size = 1620µm x 1620µm
Actual die size = 1720µm x 1720µm (after the die are cut up)
Pad size = 120µm x 120µm
Pad pitch = 150µm
Space between pads = 30µm
Page 6
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VITESSE
SEMICONDUCTOR CORPORATION
• 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
G52157-0, Rev 3.2
05/01/01
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
