VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Data Sheet
SONET/SDH 2.5Gb/s Laser Diode Driver
Figure 8: Pad Assignments for VSC7923 Die
1720µm
1620µm
50µm
50µm
VSC7923
50µm
120
120µm
150µm
PAD 34 PAD 33 PAD 32 PAD 31 PAD 30 PAD 29 PAD 28 PAD 27 PAD 26
VREF
VSS
VSS
VSS
VSS
VIP
MIP
MIP
MIB
PAD 1
DIN
PAD 2
VSS
PAD 3
DIN
PAD 4
GND
PAD 5
GND
PAD 6
GND
PAD 7
VSS
PAD 8
VSS
N/C
PAD 9
PAD 25
VIB
PAD 24
GND0
PAD 23
OUT
PAD 22
OUT
PAD 21
GND0
PAD 20
NOUT
PAD 19
VSS
PAD 18
VSS
N/C
GND
GND
GND
GND
GND NMARK MARK
PAD 10 PAD 11 PAD 12 PAD 13 PAD 14 PAD 15 PAD 16 PAD 17
30µm
1620µm
1720µm
50µm
NOTES:
1) Die size = 1620µm x 1620µm
2) Actual die size = 1720µm x 1720µm (after die are cut up)
3) Pad size = 120µm x 120µm
4) Pad pitch = 150µm
5) Space betwen pads = 30µm
Page 8
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VITESSE
SEMICONDUCTOR CORPORATION
• 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
G52203-0, Rev 3.0
05/11/01
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
