PHYSICAL LAYER PRODUCT
DATACOM PRODUCT
VSC7320
VSC7320 Meigs-I™ - 10 Gigabit MAC Chip
S P E C I F I C AT I O N S :
41.8
V Core and CSIX-64 Power Supply
43.3
V I/O and CPU Interface Power Supply
4792-Pin
EBGA Package
A P P L I C AT I O N S :
410
Gigabit Ethernet MAC
410GbE
Switch-Blades for Enterprise Based Routers
F E AT U R E S :
41
x 10 Gb/s Ethernet XGMII Interface
4CSIX-64
AC Class2 Host Interface
4Full
Bandwidth, Non-Blocking Performance on the Receive
Path and the Transmit Path
F U T U R E - P R O O F T E C H N O L O G Y:
4Internal
Short-Haul Flow Control Memory
41024
kbit Ingress and 768 kbit Egress FIFO
4Advanced
Link Aggregation/Trunking Based on SMAC/
DMAC/ MPLS Label
4Aggregation/Trunking
Between XGMII and CSIX Interfaces
4Intelligent
VLAN and MPLS Tagging and Un-tagging
4Serial
CPU Interface for Register Access
4RMON
1 Statistics Group and Applicable IEEE802.3 and
SNMP Statistics
4ASIC/FPGA
Friendly CSIX-64 Interface
4Advanced
Test Features Including Internal Loop-Back,
Frame Collection, and Replay
4Jumbo
Frame Support
4IEEE
802.3ae Compliant
Chipset application using Meigs-I directly to CSIX switch fabrics to
create 10G switching connectivity
FPGA
410GbE
Switch-to-Switch Interconnects and Uplink Port for Gigabit
4Ethernet-Based
Long-Haul Data Transport
4Backbone
Connectivity Systems for Metropolitan Optical Routers
Systems and Server Farms
4VSC7320
is part of a product roadmap that includes advanced 10 Gigabit
Ethernet technology. As such, the architecture of VSC7320 is designed
to take advantage of emerging and future technologies - effectively
allowing manufacturers to future-proof switching applications.
10 GIGABIT CONNECTIVITY WITH FPGA:
CSIX
Meigs-I
O/E
10G
Fiber
Application using the Meigs-I and a customer specific FPGA to create
10G switching connectivity
1 0 G I G A B I T C O N N E C T I V I T Y:
CSIX
Meigs-I
O/E
10G
Fiber
CSIX
O/E
Meigs-I
PB-VSC7320-002
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
