®
VITESSE
SEMICONDUCTOR CORPORATION
Link Replicator for Fibre
Channel, Gigabit Ethernet and HDTV
Preliminary Datasheet
VSC7132
Package Thermal Characteristics
The VSC7132 is packaged into a TSSOP package with 28 leads. The package construction is as shown in
Figure 4. This package allows the VSC7132 to operate with ambient temperatures up to 70
o
C in still air.
Figure 4: Package Cross Section
Epoxy
Die
Plastic Molding Compound
Exposed Leadframe
Wire Bond
Table 4: Thermal Resistance
Symbol
θ
ca-0
θ
ca-100
θ
ca-200
θ
ca-400
θ
ca-600
Description
Thermal resistance from case-to-ambient, still air
Thermal resistance from case-to-ambient, 100 LFPM air
Thermal resistance from case-to-ambient, 200 LFPM air
Thermal resistance from case-to-ambient, 400 LFPM air
Thermal resistance from case-to-ambient, 600 LFPM air
Value
45
45
41
37
33
Units
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
Moisture Sensitivity Level
This device is rated with a moisture sensitivity level 3 rating. Refer to Application Note AN-20 for appro-
priate handling procedures.
Page 6
©
VITESSE
SEMICONDUCTOR CORPORATION
• 741 Calle Plano • Camarillo, CA 93012
Tel: (800)-VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
G52243-0, Rev 3.0
9/21/00
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
