VITESSE
SEMICONDUCTOR CORPORATION
Advance Product Information
VSC7124
Package Thermal Characteristics
Quad Port Bypass Circuit
The VSC7124 is packaged in a standard plastic quad flatpack, PQFP. This package adheres to industry-stan-
dard EIAJ footprints for a 10mm body, 44-pin PQFP. The package construction is shown in Figure 4. The 44-
pin PQFP with embedded slug has the thermal properties listed in Table 2.
Figure 4: Package Cross Section
Plastic Molding Compound
Lead
Bond Wire
Die
Table 2: 44 PQFP Thermal Resistance
Symbol
θ
CA-0
θ
CA-100
θ
CA-200
θ
CA-400
θ
CA-600
Description
Thermal resistance from case-to-ambient, still air
Thermal resistance from case-to-ambient, 100 LFPM air
Thermal resistance from case-to-ambient, 200 LFPM air
Thermal resistance from case-to-ambient, 400 LFPM air
Thermal resistance from case-to-ambient, 600 LFPM air
Value
50
43
39
36
34
Units
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
The VSC7124 is designed to operate with an ambient temperature up to +70
o
C.
Moisture Sensitivity Level
This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30ºC, 60%
relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures.
G52293-0, Rev 2.3
05/07/01
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VITESSE
SEMICONDUCTOR CORPORATION
• 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
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