VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
1Gb/s 16-Channel
Drive-Side Deskew IC
VSC6250
Package Thermal Characteristics
The VSC6250 is packaged in an 128-pin, 14x20mm thermally-enhanced PQFP with an internal heat
spreader. These packages use industry-standard EIAJ footprints, which have been enhanced to improve thermal
dissipation. The construction of the packages are as shown in Figure 9. The VSC6250 is designed to operate
with a case temperature up to 90oC. The user must guarantee that the temperature specification is not violated.
Figure 9: Package Cross Section
Plastic Molding Compound
Exposed Heat Slug
Insulator
Lead
Die
Wire Bond
Thermal Epoxy
Table 7: Thermal Resistance
Symbol
Description
Value
Units
θJC
Thermal resistance from junction-to-case
6.6
23
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
θCA-0
Thermal resistance from case-to-ambient, still air
θCA-100
θCA-200
θCA-400
θCA-600
θCA-800
Thermal resistance from case-to-ambient, 100 LFPM air
Thermal resistance from case-to-ambient, 200 LFPM air
Thermal resistance from case-to-ambient, 400 LFPM air
Thermal resistance from case-to-ambient, 600 LFPM air
Thermal resistance from case-to-ambient, 800 LFPM air
21
19.9
18
17.3
16.6
Page 16
VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
G52197-0, Rev. 4.0
8/19/00
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
