SIB455EDK-T1-GE3 参数 Datasheet PDF下载

New Product

SiB455EDK

Vishay Siliconix

P-Channel 12-V (D-S) MOSFET

PRODUCT SUMMARY

V

DS

(V)

R

DS(on)

(Ω)

0.027 at V

GS

= - 4.5 V

- 12

0.039 at V

GS

= - 2.5 V

0.069 at V

GS

= - 1.8 V

0.130 at V

GS

= - 1.5 V

I

D

(A)

- 9

a

- 9

a

- 9

a

-3

11.3 nC

Q

g

(Typ.)

FEATURES

•

Halogen-free According to IEC 61249-2-21

Definition

• TrenchFET

®

Power MOSFET

• New Thermally Enhanced PowerPAK

®

SC-75 Package

- Small Footprint Area

- Low On-Resistance

• Typical ESD Performance 1500 V

• 100 % R

g

Tested

• Compliant to RoHS Directive 2002/95/EC

PowerPAK SC-75-6L-Single

APPLICATIONS

1

D

2

D

3

6

D

5

D

S

4

S

1.60 mm

G

Part # code

BKX

XXX

Lot Traceability

and Date code

G

R

S

• Load Switch, PA Switch and Battery

Switch for Portable Devices

Marking Code

1.60 mm

D

Ordering Information:

SiB455EDK-T1-GE3 (Lead (Pb)-free and Halogen-free)

P-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS

T

A

= 25 °C, unless otherwise noted

Parameter

Drain-Source Voltage

Gate-Source Voltage

T

C

= 25 °C

T

C

= 70 °C

T

A

= 25 °C

T

A

= 70 °C

T

C

= 25 °C

T

A

= 25 °C

T

C

= 25 °C

T

C

= 70 °C

T

A

= 25 °C

T

A

= 70 °C

Symbol

V

DS

V

GS

I

D

I

DM

I

S

Limit

- 12

± 10

- 9

a

- 9

a

- 7.8

b, c

- 6.2

b, c

- 25

- 9

a

- 2

b, c

13

8.4

2.4

b, c

1.6

b, c

- 55 to 150

260

Unit

V

Continuous Drain Current (T

J

= 150 °C)

Pulsed Drain Current

Continuous Source-Drain Diode Current

A

Maximum Power Dissipation

P

D

T

J

, T

stg

W

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)

d, e

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient

Maximum Junction-to-Case (Drain)

b, f

t

≤

5s

Steady State

Symbol

R

thJA

R

thJC

Typical

41

7.5

Maximum

51

9.5

Unit

°C/W

Notes:

a. Package limited.

b. Surface Mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under Steady State conditions is 105 °C/W.

Document Number: 65599

S09-2682-Rev. A, 14-Dec-09

www.vishay.com

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