BAT54 / 54A / 54C / 54S
Vishay Semiconductors
Thermal Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter
Thermal resistance junction to
ambiant air
Junction temperature
Storage temperature range
1)
Test condition
Symbol
R
thJA
T
j
= T
stg
T
S
Value
430
1)
- 65 to + 150
- 65 to + 150
Unit
°C/W
°C
°C
Device on fiberglass substrate, see layout on next page.
Electrical Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter
Reverse Breakdown voltage
Leakage current
Forward voltage
Test condition
I
R
= 100
µA
pulses
Pulse test t
p
< 300
µs, δ
< 2 % at
V
R
= 25 V
I
F
= 0.1 mA, t
p
< 300
µs, δ
< 2 %
I
F
= 1 mA, t
p
< 300
µs, δ
< 2 %
I
F
= 10 mA, t
p
< 300
µs, δ
< 2 %
I
F
= 30 mA, t
p
< 300
µs, δ
< 2 %
I
F
= 100 mA, t
p
< 300
µs, δ
< 2 %
Diode capacitance
Reverse recovery time
V
R
= 1 V, f = 1 MHz
I
F
= 10 mA through I
R
= 10 mA
to I
rr
= 1mA, R
L
= 100
Ω
Symbol
V
(BR)
I
R
V
F
V
F
V
F
V
F
V
F
C
tot
t
rr
Min
30
2
240
320
400
500
1000
10
5
Typ.
Max
Unit
V
µA
mV
mV
mV
mV
mV
pF
ns
Layout for R
thJA
test
Thickness:
Fiberglass 1.5 mm (0.059 in.)
Copper leads 0.3 mm (0.012 in.)
7.5 (0.3)
3 (0.12)
1 (0.4)
12 (0.47)
15 (0.59)
0.8 (0.03)
2 (0.8)
1 (0.4)
2 (0.8)
5 (0.2)
1.5 (0.06)
5.1 (0.2)
17451
www.vishay.com
2
Document Number 85508
Rev. 1.6, 24-Nov-04
VISHAY [ VISHAY TELEFUNKEN ]
