BAS70 THRU BAS70-06
ELECTRICAL CHARACTERISTICS
Ratings for one diode at 25 °C ambient temperature unless otherwise specified
Symbol
Reverse Breakdown Voltage
Tested with 10
µA
Pulses
Leakage Current
Pulse Test t
p
< 300
µs
at V
R
= 50 V
Forward Voltage
Pulse Test t
p
< 300
µs
at I
F
= 1 mA
at I
F
= 15 mA
Capacitance
at V
R
= 0 V, f = 1 MHz
Reverse Recovery Time
from I
F
= 10 mA through I
R
= 10 mA to I
R
= 1 mA
Thermal Resistance Junction to Ambient Air
1)
Min.
70
–
Typ.
–
20
Max.
–
100
Unit
V
nA
V
(BR)R
I
R
V
F
V
F
C
tot
t
rr
R
thJA
–
–
–
–
–
–
–
1.5
–
–
410
1000
2
5
430
1)
mV
mV
pF
ns
K/W
Device on fiberglass substrate, see layout
.30 (7.5)
.12 (3)
.04 (1)
.08 (2)
.04 (1)
.08 (2)
.59 (15)
.47 (12)
.03 (0.8)
0.2 (5)
.06 (1.5)
.20 (5.1)
Dimensions in inches (millimeters)
Layout for R
thJA
test
Thickness: Fiberglass 0.059 in (1.5 mm)
Copper leads 0.012 in (0.3 mm)
VISHAY [ VISHAY TELEFUNKEN ]
