BAS19, BAS20, BAS21
ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified
Symbol
Forward Voltage
at I
F
= 100 mA
at I
F
= 200 mA
Leakage Current
at V
R
= V
Rmax
at V
R
= V
Rmax
; T
j
= 150 °C
Dynamic Forward Resistance
at I
F
= 10 mA
Capacitance
at V
R
= 0, f = 1 MHz
Reverse Recovery Time (see figures)
from I
F
= 30 mA through I
R
= 30 mA to I
R
= 3 mA,
R
L
= 100
Ω
Thermal Resistance Junction to Ambient Air
2)
Min.
–
–
–
–
–
–
–
Typ.
–
–
–
–
5
–
–
Max.
1.0
1.25
100
100
–
5
50
Unit
V
V
nA
µA
Ω
pF
ns
V
F
V
F
I
R
I
R
r
f
C
tot
t
rr
R
thJA
–
–
430
2)
K/W
Device on fiberglass substrate, see layout.
.30 (7.5)
.12 (3)
.04 (1) .08 (2)
.04 (1)
.08 (2)
.59 (15)
.47 (12)
.03 (0.8)
0.2 (5)
.06 (1.5)
.20 (5.1)
Dimensions in inches (millimeters)
Layout for R
thJA
test
Thickness: Fiberglass 0.059 in (1.5 mm)
Copper leads 0.012 in (0.3 mm)
VISHAY [ VISHAY TELEFUNKEN ]
