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V23990-P767-A-D3-14 参数 Datasheet PDF下载

V23990-P767-A-D3-14图片预览
型号: V23990-P767-A-D3-14
PDF下载: 下载PDF文件 查看货源
内容描述: [3~rectifier,BRC,Inverter, NTC]
分类和应用:
文件页数/大小: 24 页 / 527 K
品牌: VINCOTECH [ VINCOTECH ]
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V23990-P767-A-PM  
Characteristic Values  
Conditions  
Vr [V] or  
Value  
Typ  
Parameter  
Symbol  
Unit  
IC [A] or  
IF [A] or  
V
GE [V] or  
VCE [V] or  
DS [V]  
Tj  
Min  
Max  
VGS [V]  
V
ID [A]  
Brake IGBT  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
5
5,8  
6,5  
2,2  
VGE(th)  
VCE(sat)  
ICES  
IGES  
Rgint  
td(on)  
tr  
Gate emitter threshold voltage  
Collector-emitter saturation voltage  
Collector-emitter cut-off incl diode  
Gate-emitter leakage current  
Integrated Gate resistor  
Turn-on delay time  
VCE=VGE  
0,00085  
25  
V
V
1,87  
2,32  
15  
0
0,25  
200  
1200  
0
mA  
nA  
20  
none  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
149  
150  
23  
Rise time  
28  
ns  
227  
300  
73,2  
108  
1,9  
2,84  
1,25  
2,1  
td(off)  
tf  
Turn-off delay time  
Rgoff=32 ꢀ  
Rgon=32 ꢀ  
±15  
600  
25  
Fall time  
Eon  
Turn-on energy loss per pulse  
Turn-off energy loss per pulse  
Input capacitance  
mWs  
pF  
Eoff  
Cies  
1393  
110  
82  
Coss  
Crss  
QGate  
RthJH  
RthJC  
Output capacitance  
f=1MHz  
0
25  
Tj=25°C  
Tj=25°C  
Reverse transfer capacitance  
Gate charge  
15  
960  
143  
0,85  
0,56  
nC  
Thermal grease  
thickness50µm  
λ = 0,61 W/m·K  
Thermal resistance chip to heatsink per chip  
Thermal resistance chip to case per chip  
K/W  
Brake Inverse Diode  
Tj=25°C  
Tj=150°C  
1,1  
1,69  
1,63  
2,1  
VF  
Diode forward voltage  
10  
V
Thermal grease  
thickness50µm  
λ = 0,61 W/m·K  
RthJH  
RthJC  
Thermal resistance chip to heatsink per chip  
Thermal resistance chip to case per chip  
1,92  
1,27  
K/W  
K/W  
Brake FWD  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
1,93  
1,91  
2,2  
10  
VF  
Ir  
Diode forward voltage  
25  
25  
V
A  
Reverse leakage current  
±15  
±15  
600  
600  
21,57  
24,85  
318  
IRRM  
trr  
Peak reverse recovery current  
Reverse recovery time  
A
ns  
510  
2,41  
4,97  
382  
76  
2,41  
4,97  
Qrr  
Reverse recovered charge  
Peak rate of fall of recovery current  
Reverse recovery energy  
Rgon=32ꢀ  
25  
µC  
di(rec)max  
/dt  
A/µs  
mWs  
Erec  
RthJH  
RthJC  
Thermal grease  
thickness50µm  
λ = 0,61 W/m·K  
Thermal resistance chip to heatsink per chip  
Thermal resistance chip to case per chip  
1,26  
0,83  
K/W  
Thermistor  
R25  
Rated resistance  
Deviation of R100  
Power dissipation given Epcos-Typ  
B-value  
Tol. ±5%  
Tj=25°C  
Tc=100°C  
Tj=25°C  
Tj=25°C  
20,9  
22  
2,9  
23,1  
kꢀ  
%/K  
mW  
K
DR/R  
R100=1486.1ꢀ  
P
210  
4000  
B(25/100)  
Tol. ±3%  
copyright Vincotech  
5
Revision: 3