V23990-P70X-A
flow90PACK1
V23990-P70X-F-U-01-14
Handling Instruction
Handling Instructions...
… to the PCB
ꢀ The module must be fixed to the PCB by clipping into the adequate holes before pin soldering. See
below
ꢀ After fixing all pins must be soldered into the PCB.
ꢀ During assembly, at a max. module temperature of 25°C, the pins should not be drawn or pushed
more than ±0.2 mm or loaded with a higher force than 35N.
ꢀ At a maximum substrate-temperature of 100°C the load of the pin should not exceed ±5N.
ꢀ Vibration stress on pins is not allowed
...to the heat sink
ꢀ
ꢀ
ꢀ
the heat sink surface must be clean and particle less.
the flatness must be < 0.05 mm for 100 mm continuous.
the surface roughness should be less than
RZ = 0.01 mm.
...to the thermal paste
ꢀ
homogenous applying of the thermal conducting paste over the whole module plate with a
thickness of max. 0.05 mm.
ꢀ
Thicker thermal paste can raise the value of the Rth.
...to the fastening screws to the heat sink if plain washer is used and optional with a spring lock
washer
Important parameter
screw
M4 DIN 7985
flat washer
spring washer
mounting torque
DIN 125 or DIN 433
DIN 127 or DIN 128
Ma =2.0-2.2Nm
Copyright by Vincotech
3
Revision: 1
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