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V23990-K428-A60-1A-PM 参数 Datasheet PDF下载

V23990-K428-A60-1A-PM图片预览
型号: V23990-K428-A60-1A-PM
PDF下载: 下载PDF文件 查看货源
内容描述: [Mitsubishi Generation 6.1 technology]
分类和应用:
文件页数/大小: 18 页 / 2393 K
品牌: VINCOTECH [ VINCOTECH ]
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V23990-K428-A60-PM  
Characteristic Values  
Conditions  
Value  
Typ  
Parameter  
Symbol  
Unit  
Vr [V] or  
VGE [V] or  
IC [A] or  
IF [A] or  
ID [A]  
VCE [V] or  
Tj  
Min  
Max  
VGS [V]  
VDS [V]  
D8,D9,D10,D11,D12,D13  
Forward voltage  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=°C  
1
1,09  
1,02  
0,90  
0,74  
4,00  
6,00  
1,8  
VF  
Vto  
rt  
50  
50  
50  
V
V
Threshold voltage (for power loss calc. only)  
Slope resistance (for power loss calc. only)  
Reverse current  
m  
mA  
Tj=25°C  
Tj=145°C  
Ir  
1600  
1,1  
Thermal grease  
RthJH  
Thermal resistance chip to heatsink per chip  
thickness50um  
λ = 1 W/mK  
0,90  
K/W  
T1,T2,T3,T4,T5,T6,T7  
Gate emitter threshold voltage  
Collector-emitter saturation voltage  
Collector-emitter cut-off current incl. Diode  
Gate-emitter leakage current  
Integrated Gate resistor  
Turn-on delay time  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
5,4  
1
6
6,6  
2,3  
VGE(th) VCE=VGE  
0,005  
50  
V
V
1,79  
2,12  
VCE(sat)  
ICES  
IGES  
Rgint  
td(on)  
tr  
15  
0
0,25  
500  
1200  
0
mA  
nA  
20  
none  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
106  
104  
28  
Rise time  
31  
ns  
157  
205  
58  
td(off)  
tf  
Turn-off delay time  
Rgoff=16 ꢀ  
Rgon=16 ꢀ  
±15  
600  
50  
Fall time  
89  
2,61  
4,39  
2,49  
4,09  
Eon  
Turn-on energy loss per pulse  
Turn-off energy loss per pulse  
Input capacitance  
mWs  
pF  
Eoff  
Cies  
Coss  
Crss  
QGate  
5000  
1000  
80  
Output capacitance  
f=1MHz  
0
10  
Tj=25°C  
Tj=25°C  
Reverse transfer capacitance  
Gate charge  
±15  
600  
50  
117  
nC  
Thermal grease  
thickness50um  
λ = 1 W/mK  
RthJH  
Thermal resistance chip to heatsink per chip  
0,75  
K/W  
D1,D2,D3,D4,D5,D6,D7  
Diode forward voltage  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
1
2,73  
2,18  
33  
3,4  
VF  
IRRM  
trr  
50  
50  
V
A
Peak reverse recovery current  
Reverse recovery time  
45  
388  
727  
4,01  
10,81  
1018  
295  
1,84  
5,14  
ns  
Qrr  
Reverse recovered charge  
Peak rate of fall of recovery current  
Reverse recovered energy  
Rgon=16 ꢀ  
±15  
600  
µC  
di(rec)max  
/dt  
A/µs  
mWs  
Erec  
Thermal grease  
thickness50um  
λ = 1 W/mK  
RthJH  
Thermal resistance chip to heatsink per chip  
0,93  
K/W  
Thermistor  
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
R
T=25°C  
T=100°C  
T=100°C  
T=25°C  
T=25°C  
T=25°C  
1000  
1670  
%
R/R R100=1670 ꢀ  
-3  
3
P
mW/K  
1/K  
1/K²  
7,635*10-3  
1,731*10-5  
B(25/50)  
B(25/100)  
B-value  
Vincotech NTC Reference  
E
Copyright by Vincotech  
3
Revision: 1.1