10-FZ062TA030(FB/FB01/FB02/FB03)-P983(D18/D28/D38/D48)
10-F0062TA030(FB/FB03)-P983(D19/D49)
preliminary datasheet
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
Vr [V] or
VGE [V] or
IC [A] or
IF [A] or
ID [A]
VCE [V] or
Tj
Min
Max
VGS [V]
VDS [V]
C.T. Inverse diode
Tj=25°C
Tj=125°C
1,66
1,61
VF
Diode forward voltage
V
Thermal grease
thickness≤50um
λ = 1 W/mK
RthJH
Thermal resistance chip to heatsink per chip
5,12
K/W
PFC Diode
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
2,03
1,5
12
2,7
VF
Irm
Forward voltage
15
18
V
µA
Reverse recovery time
Peak recovery current
Reverse recovery time
Reverse recovery charge
Reverse recovered energy
Peak rate of fall of recovery current
Rgoff=2ꢀ
Rgoff=2ꢀ
15
15
400
400
19,4
40,539
61,079
12
IRRM
trr
A
ns
19,4
0,2368
0,6337
0,0526
0,1334
13672
12699
Qrr
Erec
18
µC
mWs
A/µs
di(rec)max
/dt
Thermal grease
thickness≤50um
λ = 1 W/mK
RthJH
Thermal resistance chip to heatsink per chip
2,29
K/W
PFC Shunt
9,4
10
< 50
< 6.5
< 3
10,6
R1 value
R
tc
mꢀ
ppm/K
K/W
nH
Temperature coeficient
Internal heat resistance
Inductance
20°C to 60°C
Rthi
L
DC link Capacitor
C value
C
R
480
540
22
600
nF
Thermistor
Rated resistance
Deviation of R100
Power dissipation
Tj=25°C
Tj=100°C
Tj=25°C
Tj=25°C
Tj=25°C
Tj=25°C
kꢀ
%
ǑR/R R25=22 Kꢀ
-5
5
P
210
mW
mW/K
K
Power dissipation
constant
3,5
3940
4000
B(25/50)
B-value
B-value
Tol. ±3%
Tol. ±3%
B(25/100)
K
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