D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS
PERMISSIBLE CHANGE (R)
IEC
EN
60068-2
SIZE 0402 to 2512
60115-1
CLAUSE
TEST
PROCEDURE
TEST
STABILITY
CLASS 1
STABILITY
CLASS 2
METHOD
OR BETTER
OR BETTER
Stability for product types:
D/CRCW e3
1 to 10 M
(0.25 % R + 0.05 )
Solder bath method
(260 5) C;
(10 1) s
Resistance to
soldering heat
4.18.2
4.35
58 (Td)
-
(0.5 % R + 0.05 )
Flamability,
needle flame test
IEC 60695-11-5;
10 s
No burning after 30 s
(40 2) °C;
(93 3) % RH;
56 days
Damp heat,
steady state
4.24
78 (Cab)
(1 % R + 0.05 )
Endurance at
upper category
temperature
4.25.3
4.40
-
-
155 °C, 1000 h
(1 % R + 0.05 )
(2 % R + 0.1 )
IEC 61340-3-1;
3 pos. + 3 neg.
discharges;
Electrostatic
discharge
(human body model)
(1 % R + 0.05 )
ESD voltage acc. to size
Component solvent
resistance
Isopropyl alcohol;
50 °C; method 2
4.29
4.30
45 (XA)
45 (XA)
No visible damage
Isopropyl alcohol;
50 °C; method 1,
toothbrush
Solvent resistance
of marking
Marking legible,
no visible damage
f = 10 Hz to 2000 Hz;
x, y, z 1.5 mm;
A 200 m/s2;
Vibration, endurance
by sweeping
4.22
6 (Fc)
(0.25 % R + 0.05 )
(0.5 % R + 0.05 )
10 sweeps per axis
U = 15 x P70 x R
Periodic electric
overload
2 x Umax.;
0.1 s on; 2.5 s off;
4.37
4.27
-
-
(1 % R + 0.05 )
(1 % R + 0.05 )
1000 cycles
Single pulse high
voltage overload,
10 µs/700 µs
Û = 10 x P70 x R
2 x Umax.
;
10 pulses
All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Document Number: 20035
Revision: 04-Jun-12
For technical questions, contact: thickfilmchip@vishay.com
www.vishay.com
131
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