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CRCW2512562RFKEA 参数 Datasheet PDF下载

CRCW2512562RFKEA图片预览
型号: CRCW2512562RFKEA
PDF下载: 下载PDF文件 查看货源
内容描述: 标准厚膜贴片电阻 [Standard Thick Film Chip Resistors]
分类和应用:
文件页数/大小: 8 页 / 109 K
品牌: VICOR [ VICOR CORPORATION ]
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D/CRCW e3  
Standard Thick Film Chip Resistors  
Vishay  
TEST PROCEDURES AND REQUIREMENTS  
REQUIREMENTS  
PERMISSIBLE CHANGE (R)  
IEC  
EN  
60068-2  
SIZE 0402 to 2512  
60115-1  
CLAUSE  
TEST  
PROCEDURE  
TEST  
STABILITY  
CLASS 1  
STABILITY  
CLASS 2  
METHOD  
OR BETTER  
OR BETTER  
Stability for product types:  
D/CRCW e3  
1 to 10 M  
(0.25 % R + 0.05 )  
Solder bath method  
(260 5) C;  
(10 1) s  
Resistance to  
soldering heat  
4.18.2  
4.35  
58 (Td)  
-
(0.5 % R + 0.05 )  
Flamability,  
needle flame test  
IEC 60695-11-5;  
10 s  
No burning after 30 s  
(40 2) °C;  
(93 3) % RH;  
56 days  
Damp heat,  
steady state  
4.24  
78 (Cab)  
(1 % R + 0.05 )  
Endurance at  
upper category  
temperature  
4.25.3  
4.40  
-
-
155 °C, 1000 h  
(1 % R + 0.05 )  
(2 % R + 0.1 )  
IEC 61340-3-1;  
3 pos. + 3 neg.  
discharges;  
Electrostatic  
discharge  
(human body model)  
(1 % R + 0.05 )  
ESD voltage acc. to size  
Component solvent  
resistance  
Isopropyl alcohol;  
50 °C; method 2  
4.29  
4.30  
45 (XA)  
45 (XA)  
No visible damage  
Isopropyl alcohol;  
50 °C; method 1,  
toothbrush  
Solvent resistance  
of marking  
Marking legible,  
no visible damage  
f = 10 Hz to 2000 Hz;  
x, y, z 1.5 mm;  
A 200 m/s2;  
Vibration, endurance  
by sweeping  
4.22  
6 (Fc)  
(0.25 % R + 0.05 )  
(0.5 % R + 0.05 )  
10 sweeps per axis  
U = 15 x P70 x R  
Periodic electric  
overload  
2 x Umax.;  
0.1 s on; 2.5 s off;  
4.37  
4.27  
-
-
(1 % R + 0.05 )  
(1 % R + 0.05 )  
1000 cycles  
Single pulse high  
voltage overload,  
10 µs/700 µs  
Û = 10 x P70 x R  
2 x Umax.  
;
10 pulses  
All tests are carried out in accordance with the following specifications:  
EN 60115-1, generic specification  
EN 140400, sectional specification  
EN 140401-802, detail specification  
IEC 60068-2-x, environmental test procedures  
Packaging of components is done in paper or blister tapes according to IEC 60286-3.  
Document Number: 20035  
Revision: 04-Jun-12  
For technical questions, contact: thickfilmchip@vishay.com  
www.vishay.com  
131  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000