D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS
PERMISSIBLE CHANGE (R)
IEC
EN
60068-2
SIZE 0402 to 2512
60115-1
CLAUSE
TEST
PROCEDURE
TEST
STABILITY
CLASS 1
STABILITY
CLASS 2
METHOD
OR BETTER
OR BETTER
Stability for product types:
D/CRCW e3
-
1 to 10 M
4.5
4.7
-
-
Resistance
1 %
5 %
Voltage proof
U = 1.4 x Uins; 60 s
No flashover or breakdown
U = 2.5 x P70 x R
4.13
-
Short time overload
2 x Umax.;
0.25 % R + 0.05) 0.5 % R + 0.05)
duration: Acc. to style
Solder bath method;
Sn60Pb40
non activated flux;
(235 5) °C
Good tinning ( 95 % covered)
no visible damage
(2 0.2) s
4.17.2
58 (Td)
Solderability
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 5) C
Good tinning ( 95 % covered)
no visible damage
(3 0.3) s
Temperature
coefficient
(20/- 55/20) C and
(20/125/20) C
4.8.4.2
4.32
-
100 ppm/K
200 ppm/K
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
Shear
(adhesion)
21 (Uu3)
No visible damage
No visible damage, no open circuit in bent position
Depth 2 mm;
3 times
4.33
4.19
21 (Uu1)
14 (Na)
Substrate bending
(0.25 % R + 0.05 )
30 min. at - 55 °C;
30 min. at 125 °C
Rapid change of
temperature
5 cycles
1000 cycles
-
(0.25 % R + 0.05 )
(1 % R + 0.05 )
(0.5 % R + 0.05 )
(1 % R + 0.05 )
4.23
-
Climatic sequence:
Dry heat
4.23.2
2 (Ba)
125 °C; 16 h
55 °C; 90 % RH;
4.23.3
30 (Db)
Damp heat, cyclic
24 h; 1 cycle
4.23.4
4.23.5
1 (Aa)
13 (M)
Cold
- 55 °C; 2 h
(1 % R + 0.05 )
(2 % R + 0.1 )
Low air pressure
1 kPa; (25 10) °C; 1 h
55 °C; 90 % RH;
24 h; 5 cycles
4.23.6
4.23.7
30 (Db)
-
Damp heat, cyclic
DC load
U = P70 x R
U = P70 x R Umax.
;
1.5 h on; 0.5 h off;
Endurance
at 70 °C
4.25.1
-
70 °C; 1000 h
70 °C; 8000 h
(1 % R + 0.05 )
(2 % R + 0.1 )
(2 % R + 0.1 )
(4 % R + 0.1 )
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For technical questions, contact: thickfilmchip@vishay.com
Document Number: 20035
Revision: 04-Jun-12
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