BCM4414xD1E13A3yzz
Hot‑Swap Test – Scope Pictures
V
of ChiP
HI BCM
I
of VIA
HI BCM
VHI of VIA
BCM
VLO of VIA
BCM
ChiP BCM
Charge
Pump
Hot-swap
Controller
Figure 28 — High-level diagram for 384VDC BCM in a VIA package
showing internal hot-swap circuitry and ChiP BCM
Figure 30 — Hot-swap start up
The BCM in a VIA package provides the opportunity to incorporate
Hot-Swap capabilities into redundant power module arrays.
This allows telecoms and other mission critical applications to
continue operating without interruption even through failure and
replacement of one or more power modules.
Ch1: IHI of BCM#2
Ch2: VLO of BCM#2
Ch3: VHI of BCM#2 shows the fast voltage transient at the
high-side terminal of BCM#2
Hot‑Swap Test – Test circuit and Procedure
Ch4: VHI of internal ChiP BCM#2 shows the soft-start charging of
the high-side capacitor.
nꢀTwo parallel BCMs in a VIA package with mercury relay#1 open
nꢀClose mercury relay#1 and measure inrush current going
into BCM#2
+HI
–HI
+LO
–LO
+LO
–LO
Electronic
Load
Max Load
4000µF
BCM
#1
DC
Maximum Input
Voltage
Mercury
Relay #1
+HI
–HI
BCM
#2
Figure 31 — Expanded time scale version of Figure 30 showing
start up of BCM#2
Figure 29 — Hot-swap test circuit
BCM® in a VIA™ Package
Page 24 of 43
Rev 1.3
08/2020
VICOR [ VICOR CORPORATION ]
