BCM4414xD1E5135yzz
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
Min
Max
480
N/A
60
Unit
V
+HI to –HI
–1
HI_DC or LO_DC Slew Rate
+LO to –LO
Internal hot-swap circuitry
V/µs
V
–1
–0.3
10
V
EXT BIAS to SGND
0.15
5.5
5.5
3.6
A
SCL to SGND
SDA to SGND
ADDR to SGND
–0.3
–0.3
–0.3
2121
2121
707
V
V
V
Basic insulation (high voltage side to case)
VDC
VDC
VDC
Isolation Voltage /
Dielectric Withstand
Basic insulation (high voltage side to low voltage side) [b]
Functional insulation (low voltage side to case)
[b] The absolute maximum rating listed above for dielectric withstand (high voltage side to low voltage side) refers to the VIA package. The internal safety
approved isolating component (ChiP) provides reinforced insulation (4242V) from high voltage side to low voltage side. However, the VIA package itself can
only be tested at a basic insulation value (2121V).
BCM® in a VIA Package
Page 5 of 43
Rev 1.7
01/2018