BCM400x500y1K8A3z
Part Ordering Information
Input Voltage
Output
Voltage x 10
Temperature
Grade
Output
Power
Package
Size
Device
Range
Package Type
Revision
Version
BCM
400
x
500
y
1K8
A
3
z
P =
T = -40 to 125°C
M = -55 to 125°C
0 = Analog
R = Reversible
BCM = BCM 400 = 260 to 410 V
500 = 50 V
1K8 = 1,750 W
A
3 = 6123
ChiP Through Hole
All products shipped in JEDEC standard high profile (0.400” thick) trays (JEDEC Publication 95, Design Guide 4.10).
Standard Models
Part Number
VIN
Package Type
VOUT
Temperature
Power
Package Size
50 V
32.5 to 51.3 V
BCM400P500T1K8A30
260 to 410 V
ChiP Through Hole
-40°C to 125°C
1,750 W
1,750 W
1,750 W
1,750 W
6123
50 V
32.5 to 51.3 V
BCM400P500M1K8A30
BCM400P500T1K8A3R
BCM400P500M1K8A3R
260 to 410 V
260 to 410 V
260 to 410 V
ChiP Through Hole
ChiP Through Hole
ChiP Through Hole
-55°C to 125°C
-40°C to 125°C
-55°C to 125°C
6123
6123
6123
50 V
32.5 to 51.3 V
50 V
32.5 to 51.3 V
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
Min
Max
Unit
+VPRI_DC to –VPRI_DC
-1
480
V
VPRI_DC or VSEC_DC slew rate
(operational)
1
V/µs
+VSEC_DC to –VSEC_DC
TM to –VPRI_DC
-1
60
4.6
5.5
4.6
V
V
V
V
EN to –VPRI_DC
-0.3
VAUX to –VPRI_DC
BCM® Bus Converter
Page 4 of 25
Rev 1.4
07/2015
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