BCM3814x60E10A5yzz
General Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TCASE
≤100°C (T-Grade); All other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
mm / [in]
mm / [in]
mm / [in]
mm / [in]
cm3/ [in3]
Length
L
L
Lug (Chassis) Mount
95.34 / [3.75] 95.59 / [3.76] 95.84 / [3.77]
97.55 / [3.84] 97.80 / [3.85] 98.05 / [3.86]
35.29 / [1.39] 35.54 / [1.40] 35.79 / [1.41]
9.019 / [0.355] 9.40 / [0.37] 9.781 / [0.385]
31.93 / [1.95]
Length
PCB (Board) Mount
Width
W
H
Height
Volume
Weight
Vol
W
Without heatsink
130.4 / [4.6]
g / [oz]
Pin Material
Underplate
C145 copper, 1/2 hard
Low stress ductile Nickel
Palladium
50
0.8
100
6
µin
µin
Pin Finish
Soft Gold
0.12
2
Thermal
BCM3814x60E10A5yzz (T-Grade)
BCM3814x60E10A5yzz (C-Grade)
-40
-20
125
125
Operating junction temperature
Operating case temperature
TINTERNAL
BCM3814x60E10A5yzz (T-Grade),
derating applied, see safe thermal
operating area
-40
-20
100
100
°C
TCASE
BCM3814x60E10A5yzz (C-Grade),
derating applied, see safe thermal
operating area
Estimated thermal resistance to
maximum temperature internal
component from isothermal top
Thermal resistance top side
RJC_TOP
1.33
0.49
°C/W
°C/W
Estimated thermal resistance of thermal
coupling between the top and bottom
case surfaces
Thermal Resistance Coupling between
top case and bottom case
RHOU
Estimated thermal resistance to
maximum temperature internal
component from isothermal bottom
Thermal resistance bottom side
Thermal capacity
RJC_BOT
0.71
52
°C/W
Ws/°C
Assembly
BCM3814x60E10A5yzz (T-Grade)
BCM3814x60E10A5yzz (C-Grade)
-40
-40
125
125
°C
°C
Storage
Temperature
TST
Human Body Model,
ESDHBM
“ESDA / JEDEC JDS-001-2012” Class I-C
(1kV to < 2 kV)
1000
200
ESD Withstand
Charge Device Model,
“JESD 22-C101-E” Class II (200V to <
500V)
ESDCDM
BCM® in a VIA Package
Page 16 of 39
Rev 1.4
09/2016
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