BCM352x110y300B00
6.0 GENERAL CHARACTERISTICS
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature
range of -40 ºC < TC < 100 ºC (T-Grade); All other specifications are at TC = 25 °C unless otherwise noted.
ATTRIBUTE
MECHANICAL
SYMBOL
CONDITIONS / NOTES
MIN
TYP
MAX
UNIT
Length
Width
L
W
H
32.25 / [1.270] 32.50 / [1.280] 32.75 / [1.289] mm/[in]
21.75 / [0.856] 22.00 / [0.866] 22.25 / [0.876] mm/[in]
Height
Volume
Weight
6.48 / [0.255]
6.73 / [0.265]
4.81 / [0.294]
14.5 / [0.512]
6.98 / [0.275] mm/[in]
Vol
W
No heat sink
cm3/[in3]
g/[oz]
2.03
Nickel
0.51
0.02
Lead finish
Palladium
Gold
0.15
µm
0.003
0.051
THERMAL
BCM352F110T300B00 (T-Grade)
BCM352F110M300B00 (M-Grade)
-40
-55
125
125
°C
°C
Operating temperature
TJ
Isothermal heat sink and
isothermal internal PCB
Thermal resistance
fJC
1
9
°C/W
Thermal capacity
Ws/°C
ASSEMBLY
Peak compressive force
applied to case (Z-axis)
6
lbs
lbs / in2
°C
Supported by J-lead only
5.41
125
125
BCM352F110T300B00 (T-Grade)
BCM352F110M300B00 (M-Grade)
-40
-55
Storage temperature
ESD withstand
TST
°C
Human Body Model,
"JEDEC JESD 22-A114C.01" Class 1C
2000
500
ESDHBM
ESDCDM
V
Charge Device Model,
"JEDEC JESD 22-C101-D"
SOLDERING
245
90
3
°C
s
Peak temperature during reflow
Peak time above 217 °C
Peak heating rate during reflow
Peak cooling rate post reflow
SAFETY
MSL 4 (Datecode 1528 and later)
60
1.5
1.5
°C/s
6
°C/
s
Working voltage (IN – OUT)
Isolation voltage (hipot)
Isolation capacitance
VIN_OUT
VHIPOT
CIN_OUT
RIN_OUT
500
800
VDC
VDC
pF
4,242
500
10
Unpowered unit
At 500 Vdc
660
Isolation resistance
MΩ
MIL-HDBK-217Plus Parts Count -
25°C Ground Benign, Stationary,
Indoors / Computer Profile
Telcordia Issue 2 - Method I Case III;
25°C Ground Benign, Controlled
3.15
6.64
MHrs
MTBF
MHrs
cTUVus
cURus
Agency approvals / standards
CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable
BCM® Bus Converter
Page 9 of 19
Rev 1.1
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07/2015
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