BCM352x110y300B00
15.5 BCM MODULE RECOMMENDED HEAT SINK PUSH PIN LOCATION
(NO GROUNDING CLIPS)
(WITH GROUNDING CLIPS)
Notes:
5. Unless otherwise specified:
Dimensions are mm (inches)
tolerances are:
1. Maintain 3.50 (0.138) Dia. keep-out zone
free of copper, all PCB layers.
2. (A) Minimum recommended pitch is 39.50 (1.555).
This provides 7.00 (0.275) component
edge-to-edge spacing, and 0.50 (0.020)
clearance between Vicor heat sinks.
(B) Minimum recommended pitch is 41.00 (1.614).
This provides 8.50 (0.334) component
edge-to-edge spacing, and 2.00 (0.079)
clearance between Vicor heat sinks.
3. VI Chip® module land pattern shown for reference
only; actual land pattern may differ.
Dimensions from edges of land pattern
to push–pin holes will be the same for
all full-size VI Chip® products.
x.x (x.xx) = 0.3 (0.01)
x.xx (x.xxx) = 0.13 (0.005)
4. RoHS compliant per CST–0001 latest revision.
6. Plated through holes for grounding clips (33855)
shown for reference, heat sink orientation and
device pitch will dictate final grounding solution.
15.6 BCM MODULE PIN CONFIGURATION
4
3
2
1
A
B
C
D
A
B
C
D
E
Signal
Name
+Out
Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
+In
+In
–In
TM
RSV
PC
E
F
-Out
G
H
TM
H
J
RSV
PC
J
K
L
K
+Out
L
M
N
P
R
T
M
+Out
N
P
R
T
-In
-Out
–Out
Bottom View
BCM® Bus Converter
Page 18 of 19
Rev 1.1
vicorpower.com
800 927.9474
07/2015
VICOR [ VICOR CORPORATION ]
