Configuration Options
V•I Chip Bus Converter Module
(36.50)
1.437
2.95 0.07
ø
(2) PL
DOTTED LINE
INDICATES VIC
POSITION
[0.116 0.003ꢀ
NON-PLATED
THROUGH HOLE
SEE NOTE 1.
NOTES:
(18.25)
0.719
1. MAINTAIN 3.5/[0.138ꢀ DIA. KEEP OUT ZONE FREE OF
SEE NOTE 3
COPPER. ALL PCB LAYERS.
2. MINIMUM RECOMMENDED PITCH IS 39.50/[1.555ꢀ.
THIS PROVIDES 7.00/[0.276ꢀ COMPONENT EDGE-TO-EDGE SPACING.
AND 0.50/[0.020ꢀ CLEARANCE BETWEEN VICOR HEAT SINKS.
(4.37)
0.172
(7.00)
0.276
(11.37)
0.448
3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN
HOLES WILL BE THE SAME FOR ALL FULL SIZE V•I CHIPS.
(mm)
(31.48)
1.240
(2.510)
0.099
4. DIMENSION ARE inch
.
(39.50)
1.555
SEE NOTE 2.
HEAT SINK PUSH-PIN HOLE PATTERN
( TOP SIDE SHOWN )
SEE NOTE 3
•
Figure 19 — Hole location for push pin heat sink relative to V I Chip
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B384F120T30
Rev. 2.1
Page 9 of 12
VICOR [ VICOR CORPORATION ]
