V•I Chip Bus Converter Module
Configuration Options
(36.5±)
1.430
2.95±±.±0
ø
(2) PL
DOTTED LINE
INDICATES VIC
POSITION
[±.116±±.±±3ꢀ
NON-PLATED
THROUGH HOLE
SEE NOTE 1.
NOTES:
(18.25)
±.019
1. MAINTAIN 3.5/[±.138ꢀ DIA. KEEP OUT ZONE FREE OF
SEE NOTE 3
COPPER. ALL PCB LAYERS.
2. MINIMUM RECOMMENDED PITCH IS 39.5±/[1.555ꢀ.
THIS PROVIDES 0.±±/[±.206ꢀ COMPONENT EDGE-TO-EDGE SPACING.
AND ±.5±/[±.±2±ꢀ CLEARANCE BETWEEN VICOR HEAT SINKS.
(4.30)
±.102
(0.±±)
±.206
(11.30)
±.448
3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN
HOLES WILL BE THE SAME FOR ALL FULL SIZE V•I CHIPS.
(mm)
(31.48)
1.24±
(2.51±)
±.±99
4. DIMENSION ARE inch
.
(39.5±)
1.555
SEE NOTE 2.
HEAT SINK PUSH-PIN HOLE PATTERN
( TOP SIDE SHOWN )
SEE NOTE 3
•
Figure 19 — Hole location for push pin heat sink relative to V I Chip
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048F240T30
Rev. 2.3
Page 9 of 12
VICOR [ VICOR CORPORATION ]
