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B048K120T15 参数 Datasheet PDF下载

B048K120T15图片预览
型号: B048K120T15
PDF下载: 下载PDF文件 查看货源
内容描述: VI芯片 - BCM母线转换模块 [VI Chip - BCM Bus Converter Module]
分类和应用:
文件页数/大小: 16 页 / 519 K
品牌: VICOR [ VICOR CORPORATION ]
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PRELIMINARY  
Configuration Options (Cont.)  
21.5  
0.85  
22.0  
0.87  
32.0  
1.26  
32.0  
1.26  
14.0  
0.56  
11.7  
0.46  
ON–BOARD MOUNT  
with 0.25'' Pin Fins  
IN–BOARD MOUNT  
with 0.25'' Pin Fins  
(V•I Chip recessed into PCB)  
mm  
in  
mm  
in  
Figure 22— In-board with pin fins – package L  
Figure 23— On-board with pin fins – package G  
Input reflected ripple  
measurement point  
F1  
7 A  
Fuse  
+
Load  
+Out  
–Out  
+In  
R1  
Enable/Disable Switch  
0.30  
R3  
0.1 Ω  
C2  
PC  
SG  
0.47 µF  
R2  
C1  
ceramic  
2K Ω  
8 µF  
BCM  
ceramic  
C3  
1 µF  
ceramic  
D1  
SW1  
TM  
–In  
+
Temperature Monitor  
Notes:  
Source inductance should be no more than 200 nH. If source inductance is  
greater than 200 nH, additional bypass capacitance is required.  
C3 should be placed close to the load.  
D1 power good indicator will dim when a module fault is detected.  
TM should always be referenced to SG.  
Figure 24—BCM test circuit  
Application Note  
Parallel Operation  
The BCM will inherently current share when properly  
configured in an array of BCMs. Arrays may be used for  
higher power or redundancy in an application.  
delivered to the load is larger than that sourced from the input,  
allowing traces to be utilized on the input side if necessary. The  
use of dedicated power planes is, however, preferable.  
Current sharing accuracy is maximized when the source and  
load impedance presented to each BCM within an array are equal.  
The BCM power train and control architecture allow  
bi-directional power transfer, including reverse power  
processing from the BCM output to its input. Reverse power  
transfer is enabled if the BCM input is within its operating  
range and the BCM is otherwise enabled. The BCM’s ability to  
process power in reverse improves the BCM transient response  
to an output load dump.  
The recommended method to achieve matched impedances is to  
dedicate common copper planes within the PCB to deliver and  
return the current to the array, rather than rely upon traces of  
varying lengths. In typical applications the current being  
Vicor Corporation  
Tel: 800-735-6200  
V•I Chip Bus Converter  
B048K120T15  
Rev. 1.2  
Page 11 of 16  
45 vicorpower.com  
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