PRELIMINARY
Mechanical Drawings
1,00
0.039
1,00
0.039
18,00
0.709
6,0
0.24
21,5
0.85
9,00
0.354
SOLDER BALL
#A1 INDICATOR
0,51
0.020
SOLDER BALL
(106)
X ø
SOLDER BALL #A1
1,00
0.039
TYP
30,00
1.181
32,0
1.26
28,8
1.13
C
L
15,00
0.591
16,0
0.63
C
L
1,6
0.06
1,00
0.039
TOP VIEW (COMPONENT SIDE)
BOTTOM VIEW
4,0
0.16
NOTES:
1- DIMENSIONS ARE
mm
inch
.
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON BOTH TOP AND BOTTOM SURFACES
15,7
0.62
SEATING PLANE
Figure 16—BCM BGA mechanical outline; In-board mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V•I Chip
1,50
0.059
1,00
0,53
(
)
ø
PLATED VIA
0.039
0.021
CONNECT TO
INNER LAYERS
0,50
0.020
0,51
( ø
)
0.020
SOLDER MASK
DEFINED PADS
0,50
0.020
1,00
(
)
0.039
1,00
0.039
18,00
0.709
1,00
0.039
1,00
0.039
9,00
0.354
SOLDER PAD #A1
6,00
0.236
(4) X
10,00
0.394
(2) X
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
PCB CUTOUT
29,26
1.152
24,00
0.945
20,00
0.787
17,00
0.669
16,00
0.630
NOTES:
1- DIMENSIONS ARE
mm
inch
15,00
0.591
13,00
0.512
.
8,00
0.315
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
0,37
0.015
0,51
0.020
SOLDER MASK
DEFINED PAD
8,08
0.318
(106) X
ø
1,6
0.06
16,16
0.636
(4) X R
Figure 17—BCM BGA PCB land/VIA layout information; In-board mounting
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 1.7
Page 8 of 16
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VICOR [ VICOR CORPORATION ]
