V•I Chip Bus Converter Module
Specifications (continued)
General
Parameter
Min
Typ
Max
Unit
Note
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
3.5
Mhrs
25°C, GB
2,250
10
Vdc
pF
Input to output
Capacitance
Resistance
3,000
Input to output
MΩ
Input to output
cTÜVus
CE Mark
RoHS
UL/CSA 60950-1, EN 60950-1
Low voltage directive
Agency approvals
Mechanical
See Mechanical Drawings, Figures 15 – 18
Weight
0.53/15
oz/g
Dimensions
Length
1.28/32,5
0.87/22
in/mm
in/mm
in/mm
Width
Height
0.265 /6,73
Thermal
Over temperature shutdown
Thermal capacity
125
130
9.3
1.1
2.1
135
°C
Junction temperature
Ws/°C
°C/W
°C/W
Junction-to-case thermal impedance (RθJC
)
Junction-to-board thermal impedance (RθJB
)
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
Max
Unit
Note
Primary control (PC)
DC voltage
4.8
2.4
5.0
2.5
2.5
2.5
68
5.2
Vdc
Vdc
Vdc
mA
ms
Module disable voltage
Module enable voltage
Current limit
2.6
2.9
2.4
Source only
Enable delay time
Disable delay time
50
µs
See Figure 12, time from PC low to output low
Figure 12 — VOUT at full load vs. PC disable
Figure 13 — PC signal during fault
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048F320T30
Rev. 2.5
Page 5 of 12
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