Configuration Options
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. V•I CHIP™ MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE V•ICHIP PRODUCTS.
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
TOP SIDE SHOWN
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = 0.3 [0.01]
X.XX [X.XXX] = 0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
•
Figure 19 — Hole location for push pin heat sink relative to V I Chip™ module
vicorpower.com
800-735-6200
BCM™ Bus Converter
B048F096T24
Rev. 4.9
Page 9 of 12
VICOR [ VICOR CORPORATION ]
