Specifications, continued
THERMAL
Symbol
Parameter
Min
Typ
130
0.61
Max
Unit
°C
Note
Over temperature shutdown
Thermal capacity
125
135
Junction temperature
BGA package
Ws/°C
RθJC
RθJB
RθJA
RθJA
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient1
1.1
2.1
6.5
5.0
1.5
2.5
7.2
5.5
°C/W
°C/W
°C/W
°C/W
Junction-to-ambient2
Notes
1. B048K096T24 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2. B048K096T24 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Test
Standard
Environment
High Temperature Operational Life (HTOL)
Temperature Cycling
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
High Temperature Storage
150°C, 1,000 hrs
Moisture Resistance
Moisture Sensitivity Level 5
Temperature Humidity Bias Testing (THB)
Pressure Cooker Testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent Resistance/Marking Permanency
Mechanical Vibration
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20 g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500 g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Mechanical Shock
Electro Static Discharge Testing – Human Body Model
Electro Static Discharge Testing – Machine Model
Meets or exceeds 200 Volts
Highly Accelerated Life Testing (HALT)
Operation limits verified, destruct margin determined
Per Vicor Internal
Test Specification
Dynamic Cycling
Constant line, 0-100% load,
-20°C to 125°C
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION
Test
Standard
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125°C)
BGA solder fatigue evaluation
IPC-SM-785
Test duration: NTC-B (500 failure free cycles)
Solder ball shear test
IPC-9701
Failure through bulk sodder or copper pad lift-off
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K096T24
Rev. 1.9
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