Configuration Options (Cont.)
22.0
0.87
32.0
1.26
9.5
0.37
mm
in
Figure 21— On-board elevated mounting – package A
Input reflected ripple
measurement point
F1
10 A
Fuse
+Out
-Out
+In
+
Load
–
R1
Enable/Disable Switch
0.30 Ω
R3
0.1 Ω
C2
0.47 µF
TM
R2
C1
BCM
ceramic
RSV
2K Ω
10 µF
ceramic
PC
+Out
C3
10 µF
ceramic
D1
SW1
K
Ro
-In
-Out
–
+
Temperature Monitor
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance is required.
C3 should be placed close to the load.
D1 power good indicator will dim when a module fault is detected.
Figure 22—BCM test circuit
Vicor Corporation
Tel: 800-735-6200
V•I Chip Bus Converter
B048K096T24
Rev. 1.9
Page 11 of 16
45
vicorpower.com
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