MSL-1947HB3-5 参数 Datasheet PDF下载

MSL-1947HB3-5

Recommended Soldering Conditions

1.Reflow Soldering

(1).The Fig. 1 temperature profile shall be at the surface of LED resin.

(2).Number of reflow process shall be less than 2 times.

If second reflow process would be performed,intervals between first

and second process shall be as short as possible to prevent absorption of moisture to resin of LED

Cooling process to nomal temp,shall be required between first and second refiow process

(3).Temp,fluctuation to LED at pre-heat process shall be minimized.(Less than 6

o

C)

2.Dip Soldering

(1).Preheat temp,for soldering:120-150

o

C ,60-120sec

(2).Soldering temp:Temp of soldering pot 260 MAX.less than 5sec

(3).Number of dip soldering process shall be less than 2 times and

these process shall be performed in a row.

Cooling process to normal temp,shall be required between first and second soldering process.

3.Other Caution

o

(1).Manual soldering should be less than 280 C within 3 sec.

(2).Heat or UV(or both)curing resin shall used for preliminary fixing.

o

Curing condition or temp,:150 C MAX.less than 120sec

(3).Any mechanical force or any excess vibration shall not be accepted

to apply during cooling process to normal temp,after soldering

(4).If manual soldering would be performed to repair LED by tweezers,

mechanical force to resin should not be given

Unity Opto Technology Co., Ltd.

09/30/2003