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MIR-3306-TC11 参数 Datasheet PDF下载

MIR-3306-TC11图片预览
型号: MIR-3306-TC11
PDF下载: 下载PDF文件 查看货源
内容描述: SMD型反射式光电传感器超小型光斩波器 [SMD Type Reflective Photo Sensor Subminiature Photointerrupter]
分类和应用: 光电传感器斩波器
文件页数/大小: 9 页 / 231 K
品牌: UOT [ UNITY OPTO TECHNOLOGY ]
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MIR-3306-TC11
Reliability Test Item
Test Item
Description and Test Condition
Evaluates resistance of the device when
operated at electrical stress Ta=under room
temperature Test Time=1000hrs
(-24hrs,+72hrs)
Evaluates moisture resistance of the device
when stored for a long term at high
temperature and high humidityTa=85±5
o
C
Rh=85±5%RhTest Time=1000hrs
(-24hrs,+72hrs)
Evaluates device durability for long term
storage in high temperature Ta=105
o
C
Test Time=1000hrs(-24hrs,+72hrs)
Evaluates device durability for long term
storage in low temperature Ta=-55
o
C
Test Time=1000hrs(-24hrs,+72hrs)
Reference Standard
MIL-STD-750:1026
MIL-STD-883:1005
JIS C 7021:B-1
Judgement
Operation Life
ACCEPT:
Power Decay <30%
High Temperature
High Humidity
MIL-STD-202:103B
JIS C 7021:B-11
ACCEPT:
None is
OPEN/SHORT
ACCEPT:
None is
OPEN/SHORT
ACCEPT:
None is
OPEN/SHORT
ACCEPT:
None is
OPEN/SHORT
High Temperature
Storage
Low Temperature
Storage
MIL-STD-883:1008
JIS C 7021:B-10
JIS C 7021:B-12
MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1010
JIS C 7021:A-4
Evaluates resistance of device at thermal
stresses or expansion and contraction
Temperature Cycling
105
o
C ~ 25
o
C ~ -55
o
C ~ 25
o
C
30min 5min 30min 5min 20 Cycles
Thermal Shock
Evaluates device’s structure and mechanical
resistance when suddenly exposed at severe MIL-STD-202:107D
changes
MIL-STD-750:1051
o
o
MIL-STD-883:1011
105 C ~ -55 C 
10min 10min 10 Cycles
MIL-STD-202:210A
MIL-STD-750:2031
JIS C 7021:A-1
ACCEPT:
None is
OPEN/SHORT
Reflow Soldering Reflow process : Condition is as follow
Heat Resistance Test page. Less than 2 time.
ACCEPT:
None is
OPEN/SHORT
Solderability
Evaluates solderability on leads of device
T.Sol=230
o
C
Dwell Time=5 sec
Phase1:110
o
C, 85%RH, 1.242kgf/cm
2
Phase2:130
o
C, 85%RH,2.714kgf/cm
2
Distance of Dropping : 1 m
Drop the Device on the Maple Board
3 Times
MIL-STD-202:208D
ACCEPT:
MIL-STD-750:2026
95% soldering areaon
MIL-STD-883:2003
the lead frame
JIS C 7021:A-2
-
ACCEPT:
None is
OPEN/SHORT
ACCEPT:
None is
OPEN/SHORT
PresureCooker Test
Drop Test
-
Unity Opto Technology Co., Ltd.
11/06/2003