Engineering Specification
TCFE03025H90002A
RECOMMENDED REFLOW SOLDERING
The normal to Preheating
temperature
140℃ to 160℃
Preheating to 200℃
if 220℃
30s to 60s
A
B
1st rising temperature
Preheating
60s to 120s
20s to 40s
50s～60s
C 2nd rising temperature
if 230℃
40s～50s
if 240℃
30s～40s
D Main heating
if 250℃
20s～40s
if 260℃
20s～40s
200℃ to 100℃
1℃/s ～ 4℃/s
E
Regular cooling
z
According to J-STD-020C
UN Semiconductor Co., Ltd.
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@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Revision December 18, 2014
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