Surface Mount Transient Voltage Suppressors
SM8Z Series 14 To 43 V 6600W
SURFACE MOUNT TAPE AND REEL PACKAGING
G
ZONE 1
N
A
ZONE1
B
D
C
T
DIMENSIONS in millimeters (inches)
TAPE SIZE
A MAX.
D MIN.
N MIN.
G MAX. T MAX.
30.4
B MIN.
C
330 ± 2.0 (13.0 ±
0.079)
178 ± 2.0 (7.0 ±
0.079)
13.0 ± 0.20
(0.51 ±
0.0008)
20.2
(0.795)
24 mm (0.945)
50 (1.97) 26.4 (1.039)
1.5 (0.059)
(1.197)
Recommended Soldering Parameters
IR-Reflow Condition
Temp. min
Temp. max
150
200
ɗ
ɗ
Pre Heat
Time(min to max)
60-180
<3
sec
tp
TP
Ramp up rate (150-200ɗ)
ɗ/sec
Ramp-up
tL
TL
Liquidus Temp.
>220
ɗ
Ts(max)
Reflow
Peak Temp.
255-260 sec
Time(Liq. to Peak)
60-150
<3
sec
ɗ/sec
sec
Ts(min)
ts
Ramp up rate (220-200ɗ)
Perheat
www.unsemi.com.tw
Time within actual peak temp.
10-30
@ UN Semiconductor Co., Ltd. 2013
Temp from 25 °C to Peak
Specifications are subject to change without notice.
4 / 4
Ramp down Rate
<5
<6
ɗ/sec
Please refer to www.unsemi.com.tw for current information.
Time(t)
Time(25ɗ to Peak temp.)
njo
ɗ
Do not exceed
280
UN Semiconductor Co., Ltd.
Revision February 2, 2015
UNSEMI [ UN Semiconducctor INC ]
