(Chip Common Mode Filter) Engineering Specification
MCM2012B Series
RELIABILITY AND TEST CONDITION
Test item
Test condition
A. Temperature : -40 ~ +85℃
B. Cycle : 100 cycles
Criteria
A. No mechanical damage
B. Impedance value should be
within ± 20 % of the initial
value
C. Dwell time : 30minutes
Temperature Cycle
Measurement : at ambient temperature
24 hrs after test completion
A. Temperature : 85℃ ± 5℃
B. Test time : 1000 hrs
A. No mechanical damage
B. Impedance value should be
within ± 20 % of the initial
value
C. Apply current : full rated current
Operational Life
Measurement : at ambient temperature
24 hrs after test completion
A. Temperature : 40 ± 2℃
B. Humidity : 90 ~ 95 % RH
C. Test time : 1000 hrs
A. No mechanical damage
B. Impedance value should be
within ± 20 % of the initial
value
D. Apply current : full rated current
Biased Humidity
Measurement : at ambient temperature
24 hrs after test completion
A. More than 95 % of terminal
electrode should be covered
with new solder
A. Solder temperature : 260 ± 5℃
B. Flux : Rosin
Resistance to Solder
Heat
B. No mechanical damage
C .Impedance value should be
within ± 20 % of the initial
value
C. DIP time : 10 ± 1 sec
A. Temperature : 93 ± 2℃
B. Test time : 4 hrs(MCA)
Others : 8 hrs
More than 95 % of terminal
electrode should be covered
with new solder
Steam Aging Test
C. Solder temperature : 235 ± 5℃
D. Flux : Rosin
E. DIP time : 5 ± 1 sec
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2018
Revision May 8, 2018
8 / 8
Specifications are subject to change without notice.
UNSEMI [ UN Semiconducctor INC ]
