Radial Lead Transient Voltage Suppressors (TVS)
KB Series
6KA
Ratings and Characteristic Curves (TA=25°C unless otherwise noted) (Continued)
Physical Specifications
Weight
Case
Contact manufacturer
Epoxy encapsulated
Silver plated leads, solderable per
MIL-STD-750, Method 2026
Terminal
Soldering Parameters
Reflow Condition
Lead–free assembly
150°C
TP
Critical Zone
TL to TP
Ramp-up
-Temperature Min (Ts(min)
)
-Temperature Max (Ts(max)
- Time (min to max) (ts)
TL
Pre Heat
)
200°C
TS(max)
Ramp-down
60 -180 Seconds
Average ramp up rate ( Liquidus Temp TL)
to peak
TS(min)
3°C/second max
3°C/second max
Preheat
TS(max) to TL - Ramp-up Rate
Time to peak temperature
Time
25
(t 25℃ to peak)
- Temperature (TL) (Liquidus)
Reflow
217°C
- Time (min to max) (ts)
60 -150 Seconds
Flow/Wave Soldering (Solder Dipping)
Peak Temperature (TP)
260 +0/-5°C
20 -40 Seconds
6°C/second max
8 minutes Max
280°C
Time within 5°C of actual peak
Temperature (tp)
Peak Temperature :
Dipping Time :
Soldering :
265°C
Ramp-down Rate
10 seconds
1 time
Time 25°C to peak Temperature (TP)
Do not exceed
Ratings and Characteristic Curves (TA=25°C unless otherwise noted)
Pulse Derating Curve
100
80
60
40
20
0
0
25
50
75
100 125 150
175
200
TA-Ambient temperature(°C)
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Revision October 18, 2013
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UNSEMI [ UN Semiconducctor INC ]
