Radial Lead Resettable Polymer PTCs
JK30 Series
Test Procedures and Requirement
Test
Resistance
Test Conditions
In still air @25±2°C
Accept/Reject Criteria
R
min≤R≤Rmax
Hold Current
Time to Trip
60 min, at Ihold, In still air @25±2°C
Specified current, Vmax, @25±2°C
Vmax, Imax,100 cycles
No trip
T≤Maximum Time To Trip
No arcing or burning
No arcing or burning
Trip Cycle Life
Trip Endurance
Vmax,24hours
Soldering Parameters
Refer to the condition recommended
Pre-Heating Zone by the manufacturer. Max. ramping
rate should not exceed 4°C/Sec
Max. solder temperature should not
exceed 260°C
Soldering Zone
Cooling Zone
Cooling by natural convection in air
Physical Specifications
0.75-1.85A Tin-plated Copper clad steel
2.5-9.0A Tin-plated Copper
Lead Material
Soldering
Characteristics
Solder ability per MIL-STD-202, Method 208E
Cured, flame retardant epoxy polymer meets UL 94V-0
requirements.
Insulating Material
Device Labeling
Marked with ‘UN’, voltage, current rating
Part Numbering
Part Marking
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Revision October 18, 2013
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UNSEMI [ UN Semiconducctor INC ]
