Radial Lead Resettable Polymer PTCs
JK250 Series
Test
Resistance
Test Conditions
In still air @25±2°C
Accept/Reject Criteria
R
min≤R≤Rmax
Hold Current
Time to Trip
60 min, at Ihold, In still air @25±2°C
Specified current, Vmax, @25±2°C
Vmax, Imax,100 cycles
No trip
T≤Maximum Time To Trip
No arcing or burning
No arcing or burning
Trip Cycle Life
Trip Endurance
Vmax,24hours
Soldering Parameters
Refer to the condition recommended
Pre-Heating Zone by the manufacturer. Max. ramping
rate should not exceed 4°C/Sec
Max. solder temperature should not
exceed 260°C
Soldering Zone
Cooling Zone
Cooling by natural convection in air
Physical Specifications
0.02-0.04A Tin-plated Copper clad steel
0.05-2.00A Tin-plated Copper
Lead Material
Soldering
Characteristics
Solder ability per MIL-STD-202, Method 208E
Cured, flame retardant epoxy polymer meets UL 94V-0
requirements.
Insulating Material
Device Labeling
Dimensions
Marked with ‘SC’, voltage, current rating
Figure1
Figure2
Figure3
Figure4
Lead (dia)
A
B
C
D
Packaging
(Bulk Pack)
Part Number
Figure
mm
Max.
mm
Max.
mm
Typ.
mm
Max.
Inches
mm
JK250-020U
JK250-030U
JK250-040U
JK250-060U
Figure1(2)
Figure1(2)
Figure1(2)
Figure1(2)
7.4
7.4
7.4
7.4
12.7
12.7
12.7
12.7
5.1
5.1
5.1
5.1
3.8
3.8
3.8
3.8
0.020
0.020
0.020
0.024
0.5
0.5
0.5
0.6
1000
1000
1000
1000
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2013
Revision October 18, 2013
3 / 4
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
UNSEMI [ UN Semiconducctor INC ]
