(Chip Common Mode Filter) Engineering Specification
HCM2012G Series
RELIABILITY AND TEST CONDITION
Test condition
A. Temperature : -40 ~ +85℃
B. Cycle : 100 cycles
C. Dwell time : 30minutes
Temperature Cycle
Measurement : at ambient
temperature 24 hrs after test
completion
A. Temperature : 85℃ ± 5℃
B. Test time : 1000 hrs
C. Apply current : full rated current
Measurement : at ambient
temperature 24 hrs after test
completion
A. Temperature : 40 ± 2℃
B. Humidity : 90 ~ 95 % RH
C. Test time : 1000 hrs
D. Apply current : full rated current
Measurement : at ambient
temperature 24 hrs after test
completion
A. Solder temperature : 260 ± 5℃
B. Flux : Rosin
C. DIP time : 10 ± 1 sec
Test item
Criteria
A. No mechanical damage
B.Impedance value should be
within ± 20 % of the initial value
Operational Life
A. No mechanical damage
B.Impedance value should be
within ± 20 % of the initial value
A. No mechanical damage
B. Impedance value should be
within ± 20 % of the initial value
Biased Humidity
Resistance to Solder
Heat
A. More than 95 % of terminal
electrode should be covered
with new solder
B. No mechanical damage
C.Impedance value should be
within ± 20 % of the initial value
More than 95 % of terminal
electrode should be covered with
new solder
A. Temperature : 93 ± 2℃
B. Test time : 4 hrs
Steam Aging Test
C. Solder temperature : 235 ± 5℃
D. Flux : Rosin
E. DIP time : 5 ± 1 sec
13.NOTE
All the products in this specification comply with RoHS 1.0 directive.
UN Semiconductor Co., Ltd.
Revision December 18, 2014
@ UN Semiconductor Co., Ltd.
2014
7/7
Specifications are subject to change without notice.
UNSEMI [ UN Semiconducctor INC ]
