Surface Mount Transient Voltage Suppressors
试验脉冲 5a
TEST
NUMBER OF
PULSE
SYSTEM
Us(V)
Td(ms) Ri(Ω )
LEVEL
Ⅳ
12V
24V
87
174
400
350
0.5
4
10 pulse
10 pulse
Ⅳ
Soldering Parameters
Reflow Condition
Lead–free assembly
TP
Critical Zone
TL to TP
-Temperature Min (Ts(min)
)
-Temperature Max (Ts(max)
- Time (min to max) (ts)
150°C
Ramp-up
TL
Pre Heat
)
200°C
TS(max)
60 -180 Seconds
Ramp-down
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/second max
TS(min)
TS(max) to TL - Ramp-up Rate
3°C/second max
217°C
Preheat
- Temperature (TL) (Liquidus)
Reflow
25
Time to peak temperature
- Time (min to max) (ts)
Time
60 -150 Seconds
260 +0/-5°C
(t 25℃ to peak)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 -40 Seconds
Ramp-down Rate
6°C/second max
8 minutes Max
260°C
Time 25°C to peak Temperature (TP)
Do not exceed
@ UN Semiconductor Co., Ltd. 2018
Specifications are subject to change without notice.
Revision April 24, 2018
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Please refer to www.unsemi.com.tw for current information.