Surface Mount Transient Voltage Suppressors
6.0SMAJ Series 5.0 To 200V 600W
Soldering Parameters
Reflow Condition
-Temperature Min (Ts(min)
Lead–free assembly
TP
Critical Zone
TL to TP
)
150°C
Ramp-up
TL
Pre Heat
-Temperature Max (Ts(max)
- Time (min to max) (ts)
)
200°C
TS(max)
60 -180 Seconds
Ramp-down
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/second max
TS(min)
TS(max) to TL - Ramp-up Rate
3°C/second max
217°C
Preheat
- Temperature (TL) (Liquidus)
Reflow
25
Time to peak temperature
- Time (min to max) (ts)
60 -150 Seconds
Time
(t 25℃ to peak)
Peak Temperature (TP)
260 +0/-5°C
30 Seconds
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
6°C/second max
8 minutes Max
280°C
Time 25°C to peak Temperature (TP)
Do not exceed
Dimensions
Inches
Millimeters
DO-214AC (SMA)
Cathode Band
Dimensions
Min
0.049
0.162
0.099
0.077
0.030
-
Max
0.064
0.179
0.109
0.089
0.060
0.008
0.206
0.012
-
Min
1.230
4.10
2.510
1.960
0.750
-
Max
1.630
4.550
2.760
2.260
1.510
0.203
5.220
0.305
-
A
B
C
D
E
F
G
H
I
0.192
0.006
0.070
0.082
-
4.87
0.152
1.800
2.100
-
J
-
-
K
L
0.090
-
2.300
-
0.082
2.100
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
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Revision February 2, 2015
UNSEMI [ UN Semiconducctor INC ]
