Surface Mount Transient Voltage Suppressors
TP
Critical Zone
Reflow Condition
-Temperature Min (Ts(min)
Lead–free assembly
Ramp-up
TL to TP
TL
)
150°C
TS(max)
Pre Heat
-Temperature Max (Ts(max)
- Time (min to max) (ts)
)
200°C
Ramp-down
60 -180 Seconds
TS(min)
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/second max
Preheat
TS(max) to TL - Ramp-up Rate
3°C/second max
217°C
25
Time to peak temperature
Time
- Temperature (TL) (Liquidus)
Reflow
(t 25℃ to peak)
- Time (min to max) (ts)
60 -150 Seconds
260 +0/-5°C
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 -40 Seconds
Ramp-down Rate
6°C/second max
8 minutes Max
280°C
Time 25°C to peak Temperature (TP)
Do not exceed
Dimensions
Inches
Millimeters
DO-214AA (SMB)
Cathode Band
Dimensions
Min
0.077
0.171
0.130
0.084
0.030
-
Max
0.087
0.191
0.155
0.096
0.060
0.008
0.216
0.012
-
Min
1.960
4.350
3.300
2.130
0.750
-
Max
2.200
4.850
3.940
2.440
1.520
0.203
5.500
0.305
-
A
B
C
D
E
F
G
H
I
0.201
0.006
0.089
0.085
-
5.100
0.152
2.260
2.160
-
J
-
-
K
L
0.107
-
2.740
-
0.085
2.160
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
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Revision February 2, 2015
UNSEMI [ UN Semiconducctor INC ]
