37-40GHz MFC Down Converter
Chip Assembly and Mechanical Data
MFC-PO13811
LO
IN
I
OUT
120pF
To Vgx DC Gate Supply
X2
120pF
To Vdx DC Drain Supply
Q
OUT
120pF
To Vgm DC Gate Supply
120pF
To Vdl DC Drain Supply
RF
IN
Note:
Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended.
Bonding pad positions
(Chip thickness: 100µm. All dimensions are in micrometers)
Ref. : DSMFC-PO138117092 - 02 Apr 07
3/4
Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09