MFC-P09828 参数 Datasheet PDF下载

55-65GHz MFC SSB Mixer

Chip Assembly and Mechanical Data

MFC - P09828

Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.

It is necessary to use an external hybrid quadrature combiner on the IF ports if the image rejection

functionality is required.

Bonding pad positions.

( Chip thickness : 100µm. All dimensions are in micrometers )

Ref. : DSMUX-P098282134 -15-May-02

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Specifications subject to change without notice

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