CND2047
Chip Mechanical Data
10GHz Frequency Divider by 4
Vdd
CKB
CK
Vdd
Recommended die attach
Epoxy die attach is recommended.
Minimum quantity of electrically conductive
epoxy must be used, with a narrow fillet
around the die after contact
Recommended bonding
Bonding pads of the product are covered
with aluminium metallic layer.
Wedge or ball bonding can be used.
Aluminium wire has be used if the
assembly process is up to 250°C.
Otherwise the use of gold wire is possible.
The ground bounding length should be as
short as possible to optimize the use of the
product.
The bonder should be properly grounded.
Note 1: Vdd1 is used to connect the output
buffers (on Q/QB) and can be applied
separately from Vdd.
GND
GND
GND
QB
UMS
7151
Q
Vdd1
dimensions in µm :
1050 (+10 /-100) * 900 (+10 /-100)
Thickness= 300µm
±
20µm
Pads area: 100*100µm
Ordering Information
Chip form
FTP8 Package
SOIC8 Package
:CND2047-99F/00
:CND2047-SNF/23
:CND2047-DAF/20
Information furnished is believed to be accurate and reliable. However
United Monolithic Semiconductors
S.A.S.
assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of
United Monolithic Semiconductors S.A.S..
Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.
United Monolithic Semiconductors S.A.S.
products are not authorised for
use as critical components in life support devices or systems without express written approval from
United
Monolithic Semiconductors S.A.S.
Ref. : DSCND20470077 -17-Mar-00
10/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
