CHX1094
12-36GHz Frequency Multiplier
Chip Assembly and Mechanical Data
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered
Bond Pad:100 x 100
µm².
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers )
Ordering Information
Chip form
:
CHX1094-99F/00
Information furnished is believed to be accurate and reliable. However
United Monolithic Semiconductors S.A.S.
assumes no responsability for the consequences of use of such information nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under
any patent or patent rights of
United Monolithic Semiconductors S.A.S..
Specifications mentioned in this
publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied.
United Monolithic Semiconductors S.A.S.
products are not authorised for use as critical
components in life support devices or systems without express written approval from
United Monolithic
Semiconductors S.A.S.
Ref. : DSCHX10941071 -12-Mar.-01
4/4
Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
