37-40GHz Down Converter
CHR3694-QDG
Definition of the Sij reference planes
The reference planes used for Sij
measurements
given
above
are
symmetrical from the symmetrical axis of
the package (see drawing beside). The
input and output reference planes are
located at 3.18mm offset (input wise and
output wise respectively) from this axis.
Then, the given Sij parameters incorporate
the land pattern of the evaluation
motherboard
page 16.
recommended
at
the
3.18
3.18
Recommended package footprint
Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot
print recommendations.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Ref.: DSCHR3694-QDG1192 - 11 Jul 11
13/18
Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
