CHR3762-QDG
Package outline
(1)
5.5-9GHz Integrated Down Converter
Matt tin, Lead Free
Units :
From the standard :
(Green)
mm
JEDEC MO-220
(VGGD)
25- GND
1-
2-
3-
4-
5-
6-
7-
8-
Nc
IF_Q
Gnd
(2)
Gnd
(2)
IF_I
Nc
Nc
Gnd
(2)
9-
10-
11-
12-
13-
14-
15-
16-
RF in
Gnd
(2)
Nc
VG1
VD1
VG2
VD2
Nc
17-
18-
19-
20-
21-
22-
23-
24-
VG4
VD3
VG3
Nc
Gnd
(2)
LO in
Gnd
(2)
Nc
(1)
The package outline drawing included in this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2)
It is strongly recommended to ground all pins marked “Gnd” through the PCB board.
Ensure that the PCB board is designed to provide the best possible ground to the package.
Ref. : DSCHR3762-QDG2335 - 30 Nov 12
12/16
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
