24-30GHz MFC Down Converter
Chip Assembly and Mechanical Data
CHR2295
LO
IN
To Vgm DC Gate Supply
To Vgb DC Gate Supply
Q
OUT
To Vdm,Vdl DC Drain Supply
I
OUT
To Vgx DC Gate Supply
To Vga DC Gate Supply
RF
IN
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : : DSCHR22951201 -20-July-01
5/6
Specifications subject to change without notice
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