20-24GHz Down Converter
Chip Assembly and Mechanical Data
CHR2293
LO
IN
To Vgm DC Gate Supply
To Vgb DC Gate Supply
Q
OUT
To Vdm,Vdl DC Drain Supply
I
OUT
To Vgx DC Gate Supply
To Vga DC Gate Supply
RF
IN
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions
(Chip thickness: 100µm. All dimensions are in micrometers)
Ref.: DSCHR22931192 - 11 Jul 11
3/4
Specifications subject to change without notice
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